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Honor’s Magic V3, set to launch on September 5, will be the world’s thinnest foldable smartphone at 4.4mm. The device features a Snapdragon 8 Gen 3 chipset, 12GB RAM, and Google services pre-installed. It also boasts AI-powered features like AI Eraser, Face-to-Face Translation, and Notes Live Translation, all running on Google Cloud infrastructure.
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Berlin’s IFA 2024 is set to be the stage for Honor’s worldwide launch of the Magic V3 on September 5. The tech giant has revealed that the device will boast a trio of cloud-based AI features, all running on Google Cloud’s infrastructure.
The global variant of the Magic V3 is packed with AI capabilities, including the Magic Portal on Foldable feature, which enables users to run two separate floating applications at once. This advancement promises to elevate the multitasking experience for users.
Google has contributed to the device’s AI arsenal with AI Eraser, Face-to-Face Translation, and Notes Live Translation. These features require an internet connection for processing and language packages, but are designed to enhance various aspects of daily life and work, from business meetings to travel and lifestyle sharing.
The Honor Magic V3 is also set to claim the title of the world’s thinnest foldable smartphone, measuring just 4.4 mm when unfolded. The device packs a punch with its Snapdragon 8 Gen 3 chipset and a minimum of 12 GB RAM. Google services will be pre-installed on the device, offering users a seamless experience.
Meanwhile, rivals including Xiaomi and Samsung are also pushing to create the thinnest foldable devices. Samsung is reportedly working on a Galaxy Z Fold 6 Slim, which has been appearing in leaks lately. Xiaomi’s Mix Fold phones are also known for being some of the slimmest foldables, with each new generation continuing to get thinner. The next generation, the Mix Fold 5, is expected to be even thinner, rivaling the Honor Magic V3.